KOYOTECHNOS Co.,Ltd.

Top page » Inspection application

Choose from inspection applications

Wire probes are not only inspect bare boards, but also are good at narrow pitch and are widely used to package board, TAB, COF board, 4 terminal sennsinng and semiconductor inspection. Especially, the high density narrow pitch packaging board is the best by VBPC.

Narrow pitch

Narrow pitch

With progress in manufacturing technology, distance between test pads are getting narrower. We achieved 40μm matrix as an actual minimum result.

4terminal  sensing

4terminal sensing

We can achieve fully 4terminal sensing for build-up board by the VBPC.


Large current

Large current

Electric vehicles use a lot of power devices which flow large current. For power device testing, we can provide a VBPC for large current test that can flow over 1,000 A.

Heat resistant ・ Heating

Heat resistant ・ Heating

For semiconductor testing, heat resistance tests are performed from + 180℃(356℉) to -40℃(-40) . For power devices, it is performed up to 300℃(572℉). Therefore, it has the capability to withstand heating tests for in vehicle equipment and PCB for smartphone.

Semiconductor

Semiconductor

半導体検査工程でLSI(半導体集積回路)製造のウエハーテスト工程で、シリコンウエハー上に形成されたLSIチップの電気的検査に用いられる治具です。

Other test

Other test

We can test 1.0mm die size, and we also make interposer which correspond it. We can provide a mini press socket(please see below picture) which is requirement from the customer.

If you have any question,please feel free to ask.

TEL
+81-0266-73-5237
FAX
+81-0266-73-0155