Wire probes are not only inspect bare boards, but also are good at narrow pitch and are widely used to package board, TAB, COF board, 4 terminal sennsinng and semiconductor inspection. Especially, the high density narrow pitch packaging board is the best by VBPC.
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With progress in manufacturing technology, distance between test pads are getting narrower. We achieved 40μm matrix as an actual minimum result.
We can achieve fully 4terminal sensing for build-up board by the VBPC.
Electric vehicles use a lot of power devices which flow large current. For power device testing, we can provide a VBPC for large current test that can flow over 1,000 A.
Heat resistant ・ Heating
For semiconductor testing, heat resistance tests are performed from + 180℃（356℉） to -40℃（-40） . For power devices, it is performed up to 300℃（572℉）. Therefore, it has the capability to withstand heating tests for in vehicle equipment and PCB for smartphone.
We can test 1.0ｍｍ die size, and we also make interposer which correspond it. We can provide a mini press socket(please see below picture) which is requirement from the customer.
If you have any question,please feel free to ask.